Thermal Conductivity, Thermal Diffusion Coefficient, Specific Heat Capacity test

With the development of science and technology, more and more attention has been paid to the synthesis and research of new materials. The emergence of various new materials has made people have higher requirements for the performance testing of these new materials. Analysis of the thermal properties of new materials is an important part of it. For example: the outer material used by the spacecraft needs to withstand the high temperature generated by the spacecraft when it returns to the earth’s atmosphere and atmospheric friction to prevent damage to internal components; the tiny ceramics used in the field of electronics work to protect both integrated circuit boards and electronics The device will not be burned by high temperature, but also as a heat sink; also as a plastic used in the microelectronics industry, it requires both good electrical conductivity, high temperature resistance and heat dissipation performance, and understanding of the physical properties of these new materials such as thermal conductivity The nature has become a serious problem that science and technology workers have to face.

Due to the rapid development of instrument analysis technology, there are many instruments and methods for measuring thermal conductivity, which are mainly divided into two categories: one is a dynamic method for high temperature conditions or measuring materials with relatively high thermal conductivity; Steady-state method for materials with low to medium temperature conditions or low to medium thermal conductivity. The dynamic method can be divided into hot wire method and laser heat conduction method, and the steady state method is divided into heat flow method, protective plate method and protective hot wire method.

Test items	Test standard/method	Test Range	Test temperature
Thermal Conductivity Thermal diffusion coefficient Specific heat capacity	Laser method ASTM E1461	Thermal conductivity of special samples such as metals, alloys, plastics, ceramics, rubber, multilayer composite materials, powders, fibers (tablets required), and anisotropic materials can be tested up to 2000W/mk.	Normal temperature～1000℃
Thermal Conductivity Thermal diffusion coefficient Specific heat capacity	Laser method ASTM E1461	Thermal conductivity of metals, alloys, plastics, ceramics, rubber can be tested up to 2000W/mk.	Normal temperature～1000℃
Horizontal direction Thermal Conductivity	Laser method ASTM E1461	The graphite film conducts heat horizontally, the thinnest can be tested 0.015mm.	Normal temperature～300℃
Thermal Conductivity Thermal diffusion coefficient Specific heat capacity	Hot disk method	Powder, liquid, solid 0.01～400W/(mK)	Normal temperature～700℃
Thermal Conductivity Thermal resistance	Heat flow method ASTM D5470	Thermal paste, tape, silicone sheet Non-metal composite material with thermal conductivity≦4W/mk	Normal temperature～180℃

Matexcel aims to provide high-quality comprehensive third-party inspection and analysis services. If you have any questions, please feel free to contact us.

• Name
• Phone Number
• * Email
• Address
• * Service & Products of Interest
• Project Description
• Send